High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

• After-sales Service: One Year Warranty, 24h*7 Telephone Remote Support
• Warranty: One Year Warranty, 24h*7 Telephone Remote Support
• Type: Photochemical Etching Machine
• Object: Metal
• Usage: Marking & Lettering, Corrosion & Hollowed-out
• Certification: ISO9001: 2000
• Etching Type: One-Side Spray
• Precision: High Precision
• Condition: New
• The Way of Unlaod and Offload: Strip to Strip / Roll to Roll /Roll to Chip
• Speed: 2-4m/Min
• Main Process Flow: Development, Etching, Stripping, Sand Blasting
• Equipment Type: Manual, Automatic, Semi-Automatic
• Material of Tank: PP/PVC/CPVC/Stainless Steel
• Spray Material: Electronic
• Shipping Method: Sea Shipment
• Transport Package: Suitable for Sea Shipment Packing
• Specification: customized
• Trademark: Allmerit
• Origin: Dongguan, Guangdong
• Production Capacity: 100 Sets/Year

Product Description

Product Description

        High-density integrated circuit lead fream Developing/ Etching/Film removal equipment

        Speed: 2-4 m/min
        The way of unlaod and offload: Strip to Strip / Roll to Roll /Roll to Strip
        Width of the copper: 370 mm or obove
        Effective working area: More than 500 mm
        Diameter of the coil: 350-450 mm   Adjustable     Maximum load- bearing capacity of 400 kg
        Etching size accuracy: ±0.015 mm
        Baseline thickness:  0.1 mm-0.5 mm 
        Etching size tolerance: material thinkness: 0.100-0.203mm : 12.5um;
                                                                             0.254-0.381mm : 15um;
                                                                             0.508mm : 5um
         Produce products:  QFN/DFN , SOP,SOIC,PDIP,TSSOP and other ordinary tablets,tall QFP/TQFP products, such as:                                           208L,240L, etc.

        It is suitable for etching + film removal of IC frame substrate after exposure development, etching the required IC frame products according to the exposed graphics. High precision, high density, low pitch, multi-pin IC framework products to meet customer needs.

ADVANTAGE

1, The etching cylinder is made of CPVC material, which is resistant to high temperature.

2, The rocking system and conical nozzle layout ensure the accuracy and uniformity of the etching size.

3, Nozzle CPVC material, nozzle using all PVDF material, patented nozzle design blocking and easy to disassemble.

4, Etching groove equipped with LED lighting, easy to observe the etching groove inside the situation. Observation window with
built-in LED light.

5, The addition system uses an automatic measurement system with high precision and sensitivity.

6, Automatically control the addition of HCL,NaClO₃,H₂O to ensure the stability of the etching solution.

7, Software menu operation, communication with the addition system software, record and save the various parameters of the product etching, the subsequent menu operation can start fine-tuning

 

Finished Product Display

 

Component

Certifications

Our Customers

Company Profile

FAQ

FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.

Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.

Q:How long is the warranty ?
A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.

Q:What is the packaging of the equipment like? What is the delivery method?
A:Standard export fumigation sign wooden box packing or delivery by land or sea.

Q:how to install and debug the equipment after its arrival ?
A:After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.