High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

Product Details
Customization: Available
After-sales Service: One Year Warranty, 24h*7 Telephone Remote Support
Warranty: One Year Warranty, 24h*7 Telephone Remote Support
Manufacturer/Factory & Trading Company
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  • High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment
  • High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment
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  • Overview
  • Product Description
  • Finished Product Display
  • Component
  • Certifications
  • Our Customers
  • Company Profile
  • FAQ
Overview

Basic Info.

Object
Metal
Usage
Marking & Lettering, Corrosion & Hollowed-out
Certification
ISO9001: 2000
Etching Type
One-Side Spray
Precision
High Precision
Condition
New
The Way of Unlaod and Offload
Strip to Strip / Roll to Roll /Roll to Chip
Speed
2-4m/Min
Main Process Flow
Development, Etching, Stripping, Sand Blasting
Equipment Type
Automatic, Semi-Automatic
Material of Tank
PP/PVC/CPVC/Stainless Steel
Spray Material
Electronic
Shipping Method
Sea Shipment
Transport Package
Suitable for Sea Shipment Packing
Specification
customized
Trademark
Allmerit
Origin
Dongguan, Guangdong
Production Capacity
100 Sets/Year

Product Description

Product Description


        High-density integrated circuit lead fream Developing/ Etching/Film removal equipment

        Speed: 2-4 m/min
        The way of unlaod and offload: Strip to Strip / Roll to Roll /Roll to Strip
        Width of the copper: 370 mm or obove
        Effective working area: More than 500 mm
        Diameter of the coil: 
350-450 mm   Adjustable     Maximum load- bearing capacity of 400 kg
        Etching size accuracy: ±0.015 mm
        Baseline thickness:  0.1 mm-0.5 mm 
        Etching size tolerance: material thinkness: 0.100-0.203mm : 12.5um;
                                                                             0.254-0.381mm : 15um;
                                                                             0.508mm : 5um
         Produce products:  QFN/DFN , SOP,SOIC,PDIP,TSSOP and other ordinary tablets,tall QFP/TQFP products, such as:                                           208L,240L, etc.

        It is suitable for etching + film removal of IC frame substrate after exposure development, etching the required IC frame products according to the exposed graphics. High precision, high density, low pitch, multi-pin IC framework products to meet customer needs.

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

ADVANTAGE

1, The etching cylinder is made of CPVC material, which is resistant to high temperature.

2, The rocking system and conical nozzle layout ensure the accuracy and uniformity of the etching size.

3, Nozzle CPVC material, nozzle using all PVDF material, patented nozzle design blocking and easy to disassemble.

4, Etching groove equipped with LED lighting, easy to observe the etching groove inside the situation. Observation window with
built-in LED light.

5, The addition system uses an automatic measurement system with high precision and sensitivity.

6, Automatically control the addition of HCL,NaClO3,H2O to ensure the stability of the etching solution.

7, Software menu operation, communication with the addition system software, record and save the various parameters of the product etching, the subsequent menu operation can start fine-tuning

 

Finished Product Display

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment
High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment
High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

 

Component

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

Certifications

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

Our Customers

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal EquipmentHigh-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

Company Profile

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment
High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

High-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal EquipmentHigh-Density Integrated Circuit Lead Fream Developing/ Etching/Film Removal Equipment

FAQ

FAQ
Q:Are you manufacturer or trading company ?

A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.

Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.


Q:How long is the warranty ?

A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.

Q:What is the packaging of the equipment like? What is the delivery method?
A:
Standard export fumigation sign wooden box packing or delivery by land or sea.

Q:how to install and debug the equipment after its arrival ?
A:
After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.

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