• High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

After-sales Service: One Year Warranty, 24h*7 Telephone Remote Support
Voltage: 220V
Automatic Grade: Semi-Automatic
Warranty: 1 Year
Certification: ISO
The Way of Unlaod and Offload: Strip to Strip / Roll to Roll
Customization:
Manufacturer/Factory & Trading Company
Gold Member Since 2022

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Guangdong, China
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  • Overview
  • Product Description
  • Component
  • Certifications
  • Our Customers
  • Company Profile
  • FAQ
Overview

Basic Info.

Speed
0.2-2m/Min
Channel
2-6
Material of Tank
PP/PVC/CPVC/Stainless Steel
Spray Material
Electronic
Shipping Method
Sea Shipment
Transport Package
Suitable for Sea Shipment Packing
Specification
Customized
Trademark
Allmerit
Origin
Dongguan, Guangdong
Production Capacity
100 Sets/Year

Product Description

Product Description

 

       Integrated Circuit Lead Fream disc selective silver plating equipment

       Speed: 0.2-2 m/min
       Channel: 2-6
       Accuracy:  ±0.075mm
       The way of unlaod and offload: Strip to Strip 
       Location mode: Mechanical position/image recognition and localization
       Applicable product width: 25-110mm;    thickness:  0.1mm-0.5mm    Length:170mm-300mm


       This device is for QFN ,DFN(Pachage Size 2.5X2.5 - 12X12) ring plating,double ring plating and other high-precision plating process; Other types of  high-density IC lead frames such as SOP,QFP,SOT,DIP and so on.
 
High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

ADVANTAGE

1, 4 channels dislocation arrangement, and the operation does not interfere with each other.

2, The part of silver plating adopts the internal cavity reflux mode, there is no bath splash and steam generation.

3, The materials of whole machine frame all use 50-100mm SUS316L, easy to clean. And it has sufficient strength, can ensure the stability of the equipment, reduce the risk of pressure deformation.

4, Adopts the whole line tunnel operation structure, to avoid the roller type of Japan and South Korea's equipment caused the silver surface scratching, pollution and other problems .

5,  The action structure of discharge, receiving, silver plating part is complex.

6, Many advantages are the first time to achieve and use at home and abroad.
 

 

Component

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

Certifications

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

Our Customers

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating EquipmentHigh Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

Company Profile

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment
High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

High Precision Intergrated Circuit Lead Frame Platen Type Silver Plating EquipmentHigh Precision Intergrated Circuit Lead Frame Platen Type Silver Plating Equipment

FAQ

FAQ
Q:Are you manufacturer or trading company ?

A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.

Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.


Q:How long is the warranty ?

A:The warranty period of our equipment is one year. One-step service, professional engineers to follow up to solve the problem.

Q:What is the packaging of the equipment like? What is the delivery method?
A:
Standard export fumigation sign wooden box packing or delivery by land or sea.

Q:how to install and debug the equipment after its arrival ?
A:
After the equipment is issued, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.

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