Used for post-molding curing in the integrated circuit packaging industry: Ensures complete reaction of epoxy and phenolic resins in the molding compound, accelerates the continuation of cross-linking reactions, reduces the risk of delamination, and enhances product reliability; post-plating baking: Removes moisture, eliminates hydrogen embrittlement, reduces internal stress, and prevents whisker formation and product discoloration.
2, Main Technical Parameters
2.1 Temperature Range: 20ºC to 220ºC (maximum)
2.2 Temperature Fluctuation: ≤175ºC ±1.0ºC
2.3 Temperature Uniformity: No Load ≤175ºC ±2.0ºC, Full Load 40% ≤175ºC ±5.0ºC
2.4 Heating Rate: 3~5ºC/min
2.5 Cooling: Air cooling
2.6 9-point display, real-time monitoring and recording of 9 points
2.7 Main Control System: Industrial PC
2.8 Chamber Dimensions: H960mm × L680mm × W690mm
2.9 Power Supply: Three-phase 380VAC ±10%, 18kw, 50Hz
3, Features
3.1 9-point temperature measurement, 11-point over-temperature protection function ensure uniform temperature;
3.2 The entire machine is equipped with an over-temperature protection system that is completely independent of the temperature control unit;
3.3 The exhaust system uses a forced exhaust + intermittent exhaust system, automatically controlling the opening of fresh air and exhaust port dampers, to remove volatiles from the product and maximize the expulsion of volatiles during the baking process, reducing contamination on the leadframe surface and lowering the risk of delamination after product encapsulation;
3.4 Curing conditions and parameters for different products can be pre-established and stored in the equipment, and when actually used, it is only necessary to scan the product work order barcode for comparison and importation;
3.5 Features real-time display, monitoring, and storage of curing process curves, permanent saving of product work orders, process parameters, and operator information, with random inquiry and network inquiry capabilities.
FAQ
Q:Are you manufacturer or trading company ?
A:We are a professional manufacturer of large-scale research and production of semiconductor wet process equipment. We have a professional research and development team and production and assembly workshop, which can ensure quality and after-sales service.
Q:What is the width of the equipment ?
A:The width of the equipment is about two meters.
Q:How long is the warranty ?
A:The warranty period of our equipment is one year. We provide one-step service with professional engineers to follow up to solve the problem.
Q:What is the packaging of the equipment like? What is the delivery method?
A:Standard export fumigation sign wooden box packing or delivery by land or sea.
Q:How to install and debug the equipment after its arrival ?
A:After the equipment is shipped, we will arrange a senior installation and debugging team to the your company to complete the installation,debugging,training,etc.,and assist your company in the early mass production.
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